Conductive adhesive flip-chip bonding for bumped and unbumped die

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 274-278

  Connell, Glen ^a   Zenner, Robert L D ^a   Gerber, Joel A ^a  

^a 3M COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; AGING OF MATERIALS; CONDUCTIVE FILMS; FLIP CHIP DEVICES; GOLD; NICKEL;

GOLD BUMPED DIE;

BONDING;

EID: 0030710839     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)