The role of water in delamination in electronic packages: Degradation of interfacial adhesion

Journal of Adhesion Science and Technology

Volumn 18, Issue 10, 2004, Pages 1103-1121

  Leung, S Y Y ^a   Lam, D C C ^a   Luo, Shijian ^b   Wong, C P ^b  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b Georgia Institute of Technology   (United States)

Author keywords

Adhesion; Coupling agents; Delamination; Electronic packages; Epoxy; Interface

Indexed keywords

ACIDIC ENVIRONMENT; CHEMICAL KINETIC MODELS; COUPLING AGENTS; EPOXY; ADHESION DEGRADATION; ANALYTICAL PROCEDURE; APPLIED STRESS; CHEMICAL KINETIC MODEL; DEVICE ENGINEERING; DOUBLE CANTILEVER BEAM TEST; ELECTRONIC PACKAGE; ELEVATED TEMPERATURE; ENVIRONMENT CONDITIONS; INTERFACIAL ADHESIONS; INTERFACIAL BONDS; INTERFACIAL DEBONDING; MATERIAL PARAMETER; MECHANICAL LOADING; MINIMAL EFFECTS; PACKAGE RELIABILITY; POLYMERIC ADHESIVE; RELIABILITY TESTING; ROLE OF WATER; SHEAR FRACTURE; TESTING CONDITIONS; ZIRCONATES;

ADHESION; CANTILEVER BEAMS; DEBONDING; DEGRADATION; ELECTRONICS PACKAGING; EPOXY RESINS; INTERFACIAL ENERGY; KINETIC THEORY; PH; RELIABILITY; STRESSES; TEMPERATURE CONTROL; WATER; CHEMICAL RESISTANCE; COUPLING AGENTS; DELAMINATION; FRACTURE TESTING; INTERFACES (MATERIALS); LOADING; PH EFFECTS; POLYMERS;

DELAMINATION; ADHESION;

EID: 4444307231     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/1568561041581306     Document Type: Article

References (18)

1. A. J. Kinloch, Adhesion and Adhesives: Science and Technology. Chapman and Hall, London (1987).
2. J. Comyn, in: Durability of Structural Adhesives, A. J. Kinloch (Ed.), pp. 85-131. Applied Science, London (1983).
3. R. L. Shook and J. P. Goodelle, IEEE Trans. Electr. Packaging Manufact. 23, 81-86 (2000).
4. J. Sigmund and M. Kearney, Adv. Packag. 7, 50-54 (1998).
5. S. M. Wiederhorn, J. Am. Ceram. Soc. 50, 407-414 (1967).
6. S. M. Wiederhorn and L. H. Bolz, J. Am. Ceram. Soc. 53, 543-548 (1970).
7. S. M. Wiederhorn, E. R. J. Fuller and R. Thomson, Metal Sci. 14, 450-458 (1980).
8. T. A. Michalske and B. C. Bunker, J. Appl. Phys. 56, 2686-2693 (1984).
9. T. A. Michalske, B. C. Bunker and K. D. Keefer, J. Non-Cryst. Solids 120, 126-137 (1990).
10. B. C. Bunker, J. Non-Cryst. Solids 179, 300-308 (1994).
11. B. R. Lawn, Fracture of Brittle Solids, 2nd edn. Cambridge University Press, Cambridge (1993).
12. E. P. Plueddemann, in: Silanes and Other Coupling Agents, K. L. Mittal (Ed.), pp. 3-19. VSP, Utrecht (1992).
13. E. P. Plueddemann, Silane Coupling Agents, 2nd edn. Plenum Press, New York, NY (1991).
14. E. J. Ripling, J. Adhesion 3, 145-163 (1971).
15. D. C. C. Lam, F. Yang and P. Tong, IEEE Trans. Component Packaging Technol. 22, 215-220 (1999).
16. S. Luo and C. P. Wong, in: Proc. 50th IEEE Electronic Components and Technology Conference, Las Vegas, NV, pp. 311-318 (2000).
17. Y. Weitsman, J. Composit. Mater. 11, 378-394 (1977).
18. F. D. Osterholtz and E. R. Pohl, in: Silanes and Other Coupling Agents, K. L. Mittal (Ed.), pp. 119-141. VSP, Utrecht (1992).