Research on the contact resistance, reliability, and degradation mechanisms of anisotropically conductive film interconnection for flip-chip-on-flex applications

Journal of Electronic Materials

Volumn 32, Issue 4, 2003, Pages 228-234

  Zhang, J H ^a   Chan, Y C ^b  

^a SHANGHAI UNIVERSITY   (China)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Anisotropically conductive adhesive or film; Coefficient of thermal expansion; Contact resistance; Degradation mechanism; Flip chip; Oxide formation; Reliability

Indexed keywords

ADHESIVES; ANISOTROPY; FLIP CHIP DEVICES; METALLIZING; RELIABILITY; THERMAL EXPANSION;

ANISOTROPICALLY CONDUCTIVE FILMS (ACF);

CONDUCTIVE FILMS;

EID: 0037395521     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0214-z     Document Type: Article

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