Reliability of adhesive joints in dual interface smart cards

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, POLYTRONIC 2002 - Conference Proceedings

Volumn , Issue , 2002, Pages 49-53

  Holmberg, M ^a   Lenkkeri, J ^b   Lahti, M ^b   Wiik, B ^a  

^a Setec Oy   (Finland)

^b VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; ADHESIVE PASTES; ADHESIVES; BENDING TESTS; DEFORMATION; ELECTRONICS PACKAGING; MATLAB; MICROELECTRONICS; PHOTONICS; POLYMERS; RELIABILITY; SMART CARDS; TRANSPORTATION;

ADHESIVE MATERIALS; ANISOTROPICALLY CONDUCTIVE ADHESIVE; CYCLIC BENDING; ELECTRICALLY CONDUCTIVE ADHESIVES; HUMIDITY TESTS; ISOTROPICALLY CONDUCTIVE ADHESIVES; MATLAB MODELING; VISCOELASTIC BEHAVIOUR;

CONDUCTIVE FILMS;

EID: 84962286493     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/POLYTR.2002.1020182     Document Type: Conference Paper

References (4)

1. Anderson, R. Polymeric thick film, An alternative solution for contactless smart card fabrication, Workshop on smart card technologies and applications, Berlin, Germany, November 18-20, 1996.
2. Luniak, M., Monser, H.-P., Brod, V., Wolter, K.-J., 2001, Smart label uses polymer thick film technology on low-cost substrates, Proc. of Polytronic, Potsdam, Germany, October 21-24, pp. 314-318.
3. Engeldinger H., Tarantino, T., Applications and how to manufacture a dual interface card, Third international workshop on smart card technologies and applications, Berlin, Germany, November 27-28, 2000.
4. Rusanen, O & Lenkkeri, J., Thermal stress induced failures in adhesive flip chip joints. International Journal of Microcircuits & Electronic Packaging, 1999, Vol. 22, No. 4, 363-369.