A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications

Journal of Materials Science

Volumn 43, Issue 9, 2008, Pages 3072-3093

  Lin, Y C ^a   Zhong, Jue ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; CONDUCTIVE MATERIALS; JOINING;

ANISOTROPIC CONDUCTIVE ADHESIVES (ACA); ELECTRONIC PACKAGING; SOLDER INTERCONNECTS;

ADHESIVES;

EID: 41549161030     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-007-2320-4     Document Type: Article

References (163)

1. Liu J (1998) In: Conductive adhesives for electronics packaging. Electrochemical Publications, UK
2. Nagai A, Takemure K, Isaka K, Watanabe O, Kojima K, Matsuda K, Watanabe I (1998) In: Proceedings of the IEMT/IMC, Tokyo, Japan, 1998, p 353
3. Lu D, Tong QK, Wong CP (1999) In: Proceedings of the 49th ECTC, San Diego, CA, USA, 1999, p 347
4. Liu J, Lundstorm P (1999) In: Liu J (ed) Conductive adhesive for electronic packaging. Electrochemical Publications, New York, p 212
5. Lu D, Wong CP (2000) In: Proceedings of the international symposium on advanced packaging materials: processes, properties and interfaces, Braselton, GA, 2000, p 24
6. Liu J (2001) Solder Surf Mt Technol 13:39
7. Lau J, Wong CP, Lee NC, Lee SWR (2002) In: Electronics manufacturing: with lead-free, halogen-free, and conductive adhesive materials. McGraw Hill, New York
8. Tan AM, Lim SPS, Lee C (2003) In: Proceedings of the 5th electronics packaging technology, Pan Pacific Hotel, Singapore, 2003, p 390
9. Savolainen P, Saarinen I, Rusanen O (2004) In: Proceedings of the 4th international IEEE conference on polymers and adhesives in microelectronics and photonics, Portland, OR, 2004, p 99
10. Li Y, Wong CP (2004) In: Proceedings of the 4th international IEEE conference on 'polymers and adhesives in microelectronics and photonics', Portland, OR, 2004, p 1
11. Li Y, Moon K, Wong CP (2005) Science 308:1419
12. Li Y, Wong CP (2006) Mater Sci Eng R 51:1
13. Watanabe I, Fujinawa T, Arifuku M, Fujii M, Gotoh Y (2004) In: Proceedings of the 9th IEEE international symposium on advanced packaging materials: processes, properties and interfaces, Atlanta, GA, 2004, p 11
14. Reinke RR, Kennedy TW (1988) In: Proceedings of the SID international symposium on digest of technical papers, 1988, p 305
15. Hu DC, Ho SJ, Tang BY (1992) In: Proceedings of the 13th IEEE/CHMT international electronics manufacturing technology symposium, 1992, p 277
16. Lee CH, Loh KI (1995) In: Proceedings of the 45th ECTC, Las Vegas, NV, 1995, p 21
17. Baumbach J, Baur H, Lueder E, Yamauchi A, Dorfmueller L, Knoll PM (1999) In: Proceedings of the international symposium of society for information display, San Jose, CA, 1999, p 848
18. Watanabe I, Fujinawa T, Arifuku M, Kobayashi K, Gotoh Y (2004) In: Proceedings of the international IEEE conference on the Asian green electronics, Hongkong/Shenzen, China, 2004, p 229
19. Otsuki H, Morishita H, Kokogawa T, Adachi K, Matsukawa F, Takasago H (1991) In: Proceedings of the international symposium on microelectronics, 1991, p 86
20. Liu J, Boustedt K, Lai ZH (1996) Circ World 22:19
21. Miessner R, Aschenbrenner R, Reichi H, Ling S, Binh L, Lew A, Benson R, Nhan E (2000) In: Proceedings of the 50th ECTC, Las Vegas, NV, 2000, p 1133
22. Li L, Treliant F (2000) In: Proceedings of the 4th IEEE international conference on adhesive joining and coating technology in electronics manufacturing, Espoo, Finland, 2000, p 129
23. Gustafsson K, Mannan S, Liu J, Lai ZH, Whalley D, Williams D (1997) In: Proceedings of the 47th ECTC, San Jose, CA, May 1997, p 561
24. Liu J (1999) The advanced flip-chip workshop, Atlanta, USA
25. Miessner R, Aschenbrenner R, Reichl H (1999) In: Proceedings of the 49th ECTC, San Diego, CA, 1999, p 595
26. Ogunjimi AO, Mannan SH, Whalley DC, Williams DJ (1996) IEEE Trans Comp Package 19:257
27. Oguibe CN, Mannan SH, Whalley DC, Williams DJ (1998) In: Proceedings of the 3rd IEEE international conference on adhesive joining and coating technology in electronics manufacturing, Binghamton, New York, 1998, p 27
28. Zhong ZW (2001) Microelectron Int 18:15
29. Mannan SH, Williams DJ, Whalley DC (1997) J Mater Sci-Mater Electron 8:223
30. Cao LQ, Li SM, Lai ZH, Liu J (2005) J Electron Mater 34:1420
31. Sarker G, Mridha S, Chong TT, Tuck WY, Kwan SC (1999) J Mater Process Technol 484:89
32. Lai Z, Liu J (1996) IEEE Trans Comp Package B 19:644
33. Wu SX, Zhang C, Yeh CP, Wille S, Wyatt K (1997) In: Proceedings of the 47th ECTC, San Jose, CA, 1997, p 550
34. Chan YC, Uddin MA, Alam MO, Chan HP (2003) J Electron Mater 32:131
35. Zhuqing Z, Wong CP (2002) In: Proceedings of the 8th international symposium on advanced packaging materials, Piscataway, NJ, 2002, p 194
36. Xiao AY, Jacobson SH (1999) In: Proceedings of the 5th international symposium on advanced packaging materials, Chateau Elan, Braselton, GA, 1999, p 21
37. Rogers AD, Pearl LS (2003) Polym Eng Sci 43:14
38. Hsu DT, Kim HK, Shi FG, Tong HY, Chungpaiboonpatana S, Davidson C, Adams JM (2000) Microelectron Int 17:22
39. Wu X, Hao H (2005) J Manuf Sci Eng 127:411
40. Lee JY, Shim MJ, Kim SW (1997) Mater Chem Phys 48:36
41. Lin F, Bhatia GS, Ford JD (1993) Appl Polym Sci 49:1901
42. Roşu D, Caşcaval CN, Mustatǎ F, Ciobanu C (2002) Thermochim Acta 383:119
43. Prime RB (1997) In: Thermal characterization of polymeric materials, 2nd edn. Academic Press, New York, p 1598
44. Barral L, Cano J, López J, López-Bueno I, Nogueira P, Torres A, Ramírez C, Abad MJ (2000) Thermochim Acta 344:127
45. Williams DJ, Whalley DC, Boyle OA, Ogunjimi AO (1993) Solder Surf Mt Techol 14:4
46. Hu KX, Yeh CP, Wyatt KW (1997) IEEE Trans Comp Package Manuf Technol A 20:470
47. Yim MJ, Paik KW (1998) IEEE Trans Comp Package Manuf Technol A 21:226
48. Shi FG, Abdullah M, Chungpaiboonpatana S, Okuyama K, Davidson C, Adams JM (1999) Mater Sci Semicond Process 2:263
49. Oguibe CN, Mannan SH, Whalley DC, Williams DJ (1998) IEEE Trans Comp Package Manuf Technol A 21:235
50. Fu Y, Willanter M, Liu J (2001) IEEE Trans Comp Package Technol 24:250
51. Chin M, Iyer KA, Hu SJ (2004) IEEE Trans Comp Package Technol 27:317
52. Constable JH (2006) IEEE Trans Comp Package Technol 29:494
53. Chiu YW, Chan YC, Lui SM (2002) Microelectron Reliab 42:1945
54. Connell G, Zenner RLD, Gerber JA (1997) In: Proceedings of the 47th ECTC, San Jose, CA, 1997, p 274
55. Chan YC, Luk DY (2002) Microelectron Reliab 42:1185
56. Luk CF, Chan YC, Hung KC (2002) Microelectron Reliab 42:767
57. Zhang JH, Chan YC, Zeng ZM, Chiu YW (2002) In: Proceedings of the 52nd ECTC, San Diego, CA, 2002, p 1569
58. Wu YP, Alam MO, Chan YC, Wu BY (2004) Microelectron Reliab 44:295
59. Zhang JH, Chan YC (2004) In: Proceedings of the 6th IEEE conference on high density microsystem design and packaging and component failure analysis, Shanghai, China, 2004, p 277
60. Tan SC, Chan YC, Chiu YW, Tan CW (2004) Microelectron Reliab 44:495
61. Uddin MA, Alam MO, Chan YC, Chan HP (2004) Microelectron Reliab 44:505
62. Rizvi MF, Chan YC, Bailey C, Lu H, Sharif A (2005) Solder Surf Mt Technol 17:40
63. Chen X, Zhang J (2005) Key Eng Mater 297:918
64. Chen X, Zhang J, Jiao C, Yu L (2006) Microelectron Reliab 46:774
65. Chan YC, Luk DY (2002) Microelectron Reliab 42:1195
66. Williams DJ, Whalley DC (1993) J Electron Manuf 3:85
67. Mannan SH, Williams DJ, Whalley DC, Ogunjimi AO (1999) In: Liu J (ed) Conductive adhesives for electronics packaging, Ch. 4. Electrochemical Publications Ltd, Port Erin
68. Zou G, Grönqvist H, Liu J (2004) IEEE Trans Comp Package Technol 27:546
69. Yim MJ, Hwang J, Paik KW (2007) Int J Adhes Adhes 27:77
70. Kang IB, Haskard MR, Ju BK (1996) In: Proceedings of the SPIE-the international society for optical engineering, San Jose, CA, 1996, p 280
71. Yim MJ, Paik KW, Kim YK, Hwang HN (1997) In: Proceedings of the Pacific Rim/ASME international intersociety electronic and photonic packaging conference, New York, 1997, p 65
72. Pinardi K, Liu J, Haug R, Treutler C, Willander M (1998) In: Proceedings of the 3rd IEEE international conference on adhesive joining and coating technology in electronics manufacturing, Binghamton, New York, 1998, p 34
73. Yim MJ, Paik KW (1999) IEEE Trans Adv Package 22:166
74. Prabhakumar A, Constable JH (2001) In: Proceedings of the 51st electronic component and technology conference, Orlando, Florida USA, 2001, p 580
75. Frisk L, Seppälä A, Ristolainen E (2004) Microelectron Reliab 44:1305
76. Seppälä A, Ristolainen E (2004) Microelectron Reliab 44:639
77. Lim Pei Siang S, Tan AM, Lee C (2004) In: Proceedings of the 6th electronics packaging technology conference, Shenzhen, China, 2004, p 450
78. Lee KK, Ng KT, Tan CW, Chan YC, Cheng LM (2004) In: Proceedings of the international conference on 'the business of electronic product reliability and liability', Shanghai, China, 2004, p 134
79. Chan KK, Yeung NH, Chan YC, Tan SC, Lee KK (2003) In: Proceedings of the 53rd ECTC, LA, 2003, p 1701
80. Miessner R, Aschenbrenner R, Reichl H (1999) In: Proceedings of the 49th electronic component and technology conference, San Diego, CA, 1999, p 595
81. Cao LQ, Lai ZH, Liu J (2004) In: Proceedings of the 6th IEEE conference on high density microsystem design and packaging and component failure analysis, Shanghai, China, 2004, p 254
82. Inoue M, Miyamoto T, Suganuma K (2004) In: Proceedings of the 6th IEEE conference on 'high density microsystem design and packaging and component failure analysis', Shanghai, China, 2004, p 248
83. Lee KK, Tan SC, Chan YC (2005) J Electron Package 127:52
84. Zhang J, Jia H, Chen X (2006) J Electron Packag 6:33
85. Seppälä A, Ristolainen E (2004) Microelectron Reliab 44:639
86. Sugiyama T (2000) In: The latest bare chip bonding by ACF, documentation from Sony Chemicals Seminar at Chalmers University of Technology
87. Törnvall M (2000) In: Proceedings of a Swedish national seminar on environmentally compatible materials research for electronics packaging, IVF, Sweden, 2000, IVF 5
88. Yin CY, Alam MO, Chan YC, Bailey C, Lu H (2003) Microelectron Reliab 43:625
89. Yin CY, Lu H, Bailey C, Chan YC (2004) In: Proceedings of the international IEEE conference on the Asian green electronics, Hongkong/Shenzen, China, 2004, p 240
90. Chiang WK, Chan YC (2004) In: Proceedings of the international IEEE conference on the Asian green electronics, Hongkong/Shenzen, China, 2004, p 235
91. Yin CY, Lu H, Bailey C, Chan YC (2004) IEEE Trans Electron Package Manuf 27:254
92. Chiang WK, Chan YC (2005) J Electron Package 127:113
93. Wong CC (1993) In: Doane DA, Franzon PD (eds) Multichip module technologies and alternatives. Van Nostrand Reinhold, New York, p 429
94. Fan SH, Chan YC (2002) Microelectron Reliab 42:1081
95. Fan SH, Chan YC (2002) In: Proceedings of the 52nd ECTC, San Diego, CA, 2002, p 1605
96. Xie B, Shi XQ, Ding H, Qiao K (2006) In: Proceedings of the 10th intersociety conference on thermal and thermomechanical phenomena in electronics systems, San Diego, CA, 2006, p 848
97. Liu J (1993) Circ World 19:4
98. Stam F, O'Grady P, Barrett J (1995) J Electron Manuf 5:1
99. Lai ZH, Liu J (1996) IEEE Trans Comp Package Technol B 19:644
100. Liu J, Tolvgard A, Malmodin J, Lai Z (1999) IEEE Trans Comp Package Technol 22:186
101. Weidler JD, Burg RD, Decker JJ, Constable JH (2000) In: Proceedings of the 50th ECTC, Las Vegas, NV, 2000, p 906
102. Lefebvre DR (2000) J Adhes Sci Technol 14:925
103. Liu J (2001) In: Proceedings of the 1st international IEEE conference on 'polymers and adhesives in microelectronics and photonics', Potsdam, Germany, 2001, p 209
104. Fujiwara S, Harada M, Fujita Y, Hachiya T, Muramatsu M (2002) In: Proceedings of the 52nd ECTC, San Diego, CA, 2002, p 1124
105. Wu CML, ML Chau (2002) Solder Surf Mt Technol 14:51
106. Wei Z, Waf LS, Loo NY, Koon EM, Huang M (2002) In: Proceedings of the 4th EPTC, Grand Copthorne Waterfront Hotel, Singapore, 2002, p 133
107. Tan CW, Chan YC, Yeung NH (2002) Microelectron Reliab 43:481
108. Tan CW, Chan YC, Yeung NH (2003) Microelectron Reliab 43:279
109. Tan CW, Chiu YW, Chan YC (2003) Mat Sci Eng B-Solid 98:255
110. Wang ZP (2003) In: Proceedings of the 5th EPTC, Pan Pacific Hotel, Singapore, 2003, p 595
111. Mercado LL, White J, Sarihan V, Lee TYT (2003) IEEE Trans Comp Package Technol 26:509
112. Zhang JH, Chan YC (2003) J Electron Mater 32:228
113. Zhang JH, Chan YC (2004) In: Proceedings of the 6th IEEE conference on high density microsystem design and packaging and component failure analysis, Shanghai, China, 2004, p 277
114. Uddin MA, Chan YC, Chan HP, Alam MO (2004) J Electron Mater 33:14
115. Wu YP, Alam MO, Chan YC, Wu BY (2003) In: Proceedings of the 53rd ECTC, New Orleans, LA, 2003, p 544
116. Chen X, Zhang J, Wang ZP (2004) In: Proceedings of the 9th intersociety conference on thermal and thermomechanical phenomena in electronics systems, Las Vegas, NV, 2004, p 453
117. Kwon WS, Ham SJ, Yim MJ, Lee SB, Paik KW (2005) J Electron Package 127:86
118. Yang SY, Kwon WS, Lee SB, Paik KW (2005) Key Eng Mater 297-300:887
119. Teh LK, Teo M, Anto E, Wong CC, Mhaisalkar SG, Teo PS, Wong EH (2005) IEEE Trans Comp Package Technol 28:506
120. Kwon WS, Paik KW (2006) Microelectron Reliab 46:589
121. Lin YC, Chen X, Wang ZP (2006) J Adhes Sci Technol 20:1383
122. Lin YC, Chen X, Zhang HJ, Wang ZP (2006) Mater Lett 60:2958
123. Zhang J, Chen X, Jia H (2006) J Zhengzhou Univer 27:48
124. Chen X, Zhang J (2006) Key Eng Mater 324:471
125. Luo SJ, Leisen J, Wong CP (2002) J Appl Polym Sci 85:1
126. Leung SYY, Lam DCC, Luo SJ, Wong CP (2004) J Adhes Sci Technol 18:1103
127. Lin YC, Chen X (2005) Polymer 46:11994
128. Lin YC, Chen X (2005) Chem Phys Lett 412:322
129. Lin YC, Chen X (2005) Mater Lett 59:3831
130. Lin YC (2006) In: Investigation of characteristics for adhesive and bonding reliability for COG assembly under hygrothermal conditions, PhD thesis, Tianjin University, Tianjin, China
131. Lu D, Tong QK, Wong CP (1999) IEEE Trans Comp Package Manuf Technol C 22:228
132. Lu D, Wong CP (1999) In: Proceedings of the 2nd international IEEE symposium on polymeric electron packaging, 1999, p 1
133. Lu D, Wong CP (2000) IEEE Trans Comp Package Technol 23:440
134. Shimada Y, Lu DQ, Wong CP (2000) J Electron Manuf 10:97
135. Lin YC, Chen X, Wang ZP (2006) In: Proceedings of the 10th intersociety conference on thermal and thermomechanical phenomena in electronics systems, San Diego, CA, 2006, p 826
136. Rizvi MJ, Chan YC, Bailey C, Lu H (2005) Microelectron Reliab 45:589
137. Lin YC, Chen X, Wang ZP (2006) In: Proceedings of the 10th intersociety conference on thermal and thermomechanical phenomena in electronics systems, San Diego, CA, 2006, p 946
138. Rizvi MJ, Bailey C, Chan YC, Lu H (2006) In: Proceedings of the 10th intersociety conference on thermal and thermomechanical phenomena in electronics systems, San Diego, CA, 2006, p 855
139. Ali L, Chan YC, Alam MO (2005) Solder Surf Mt Technol 17:20
140. Islam RA, Chan YC, Ralph B (2004) J Mater Res 19:1662
141. Lam DCC, Shen C, Xie JF, Karim Z, Tong P (1996) In: Proceedings of the electronic packaging materials science IX. Symp, Boston, MA, 1996, p 297
142. Lai ZH, Lai R, Persson K, Liu J (1998) J Electron Manuf 8:217
143. Persson K, Lai Z, Zribi A, Liu J, Willander M (1998) In: Proceedings of the 3rd IEEE international conference on adhesive joining and coating technology in electronics manufacturing, Binghamton, NY, 1998, p 132
144. Pinardi K, Lai Z, Vogel D, Yi LK, Liu J, Liu S, Haug R, Willander M (2000) IEEE Trans Comp Package Manuf Technol 23:447
145. Pinardi K, Lai Z, Yi LK, Liu J, S Liu, Haug R (2000) In: Proceedings of the 50th ECTC, Las Vegas, NV, 2000, p 1118
146. Wu CML, Liu J, Yeung NH (2000) In: Proceedings of the 4th IEEE international conference on adhesive joining and coating technology in electronics manufacturing', Espoo, Finland, 2000, p 101
147. Wu CML, Liu J, Yeung NH (2001) Solder Surf Mt Technol 13:25
148. Yim MJ, Jeon YD, Paik KW (2000) IEEE Trans Electron Package Manuf 23:171
149. Yim MJ, Paik KW (2001) IEEE Trans Comp Package Manuf Technol 24:24
150. Kwon WS, Paik KW (2003) In: Proceedings of the 3rd international IEEE conference on polymers and adhesives in microelectronics and photonics, Montreux, Switzerland, 2003, p 351
151. Teo M, Mhaisalkar SG, Wong EH, Teo PS, Wong CC, Ong K, Goh CF (2003) In: Proceedings of the 5th electronics packaging technology conference, Pan Pacific Hotel, Singapore, 2003, p 718
152. Teo M, Mhaisalkar SG, Wong EH, Teo PS, Wong CC, Ong K, Goh CF, Teh LK (2005) IEEE Trans Comp Package Technol 28:157
153. Hwang JS, Yim MJ, Paik KW (2005) J Electron Mater 34:1455
154. Hwang JS, Yim MJ, Paik KW (2006) J Electron Mater 35:1722
155. Yim MJ, Kim HJ, Chung CK, Paik KW (2006) In: Proceedings of the 56th ECTC, San Diego, CA, 2006, p 338
156. Liu J, Lai Z (1999) In: Proceedings of the international intersociety on electronic packaging technical/business conference & exhibition, Maui, HI, 1999, p 1691
157. Seppälä A, Pienimaa S, Ristolainen E (2001) Int J Microcircuits Electron Package 24:148
158. Fan SH, Chan YC (2003) J Electron Mater 32:101
159. Yeung NH, Chan YC, Tan CW (2003) J Electron Package 125:624
160. Sarkar G, Mridha S, Tan TC, Wu YT, Sem CK (1999) J Mater Process Technol 89-90:484
161. Paik KW, Yim MJ, Kwon WS (2001) In: Proceedings of the 6th annual Pan Pacific microelectronics symposium, Kauai, HA, 2001, p 217
162. Dou GB, Chan YC, Liu J (2003) J Electron Package 125:609
163. Cao LQ, Li SM, Lai ZH, Liu J (2005) J Electron Mater 34:1420