Electro-thermo-mechanical responses of conductive adhesive materials

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 4, 1997, Pages 470-477

  Hu, Kai X ^a   Yeh, Chao Pin ^a   Wyatt, Karl W ^a  

^a MOTOROLA INC   (United States)

Author keywords

Conductive adhesive; Contact resistance; Thermal expansion

Indexed keywords

CONDUCTIVE MATERIALS; DEFORMATION; ELECTRIC CONTACTS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; PARTICLES (PARTICULATE MATTER); STIFFNESS; THERMAL EXPANSION; VOLUME FRACTION;

CONDUCTIVE ADHESIVE MATERIALS; MORI TANAKA'S METHOD;

ADHESIVES;

EID: 0031334644     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.650937     Document Type: Article

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