Effect of misalignment on the electrical characteristics of anisotropic conductive adhesive joints

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1605-1612

  Fan, S H ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; ELECTRIC CONDUCTORS; ELECTRIC INSULATION; ELECTRIC LOADS; ELECTRIC PROPERTIES; MATHEMATICAL MODELS;

ANISOTROPIC CONDUCTIVE FILMS (ACF); DIELECTRIC DAMAGE;

CONDUCTIVE FILMS;

EID: 0036292728     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)

1. An overview and evaluation of anisotropically conductive films for fine pitch electronic assembly
2. Z-axis conductive adhesives as solder replacement
3. Z-axis conductive adhesive for fine-pitch interconnection
4. Adhesive flip chip bonding on flexible substrates
5. Bonding flexible circuits and bare chips with anisotropic electrically conductive and nonconductive adhesives
6. A pressure dependent conduction model for electrically conductive adhesives
7. Electrical conduction of anisotropic conductive adhesives: Effect of size distribution of conducting filler particles
8. Experimental and theoretical characterization of electrical contact in anisotropically conductive adhesive
9. The contact resistance and reliability of anisotropically conductive film (ACF)
10. Effect of misalignment on electrical characteristics of ACF joints for flip chip on flex applications
11. The assembly process for anisotropic conductive joints-some new experimental and theoretical results