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Volumn , Issue , 1999, Pages 21-26
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Curing kinetics study for designing of novel electronic adhesives
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Author keywords
adhesives; curing kinetics; DSC; electron donor acceptor; molecular modeling
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Indexed keywords
ADHESIVES;
DIFFERENTIAL SCANNING CALORIMETRY;
ELECTRONICS INDUSTRY;
ELECTRONS;
FREE RADICALS;
INTERFACES (MATERIALS);
KINETICS;
MOLECULAR MODELING;
MONOMERS;
PACKAGING MATERIALS;
STOICHIOMETRY;
BACKBONE STRUCTURES;
CURING KINETICS;
ELECTRON ACCEPTOR;
ELECTRON DONORS;
ELECTRONIC CHARACTERISTICS;
IN-DEPTH UNDERSTANDING;
RAPID-CURE ADHESIVES;
STOICHIOMETRY RATIO;
CURING;
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EID: 41549154308
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ISAPM.1999.757281 Document Type: Conference Paper |
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Times cited : (1)
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References (3)
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