A study of contact resistance of conductive adhesives based on anhydride-cured epoxy systems

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 3, 2000, Pages 440-446

  Lu, Daoqiang ^a,b   Wong, C P ^a,b  

^a IEEE   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Anhydride; Contact resistance; Corrosion inhibitor; Electrically conductive adhesives; Electronics packaging; Epoxy

Indexed keywords

AGING OF MATERIALS; ATMOSPHERIC HUMIDITY; CONDUCTIVE MATERIALS; CORROSION INHIBITORS; CURING; ELECTRONICS PACKAGING; EPOXY RESINS; MOISTURE;

ANHYDRIDE-CURED EPOXY SYSTEMS; CONTACT RESISTANCE; ELECTRICALLY CONDUCTIVE ADHESIVES (ECA);

ADHESIVES;

EID: 0034275050     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.868842     Document Type: Article

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