An Alternative Model for Predicting the Cure Kinetics of a High Temperature Cure Epoxy Adhesive

Polymer Engineering and Science

Volumn 43, Issue 1, 2003, Pages 14-25

  Rogers, Angela D ^a   Lee Sullivan, Pearl ^a  

^a UNIVERSITY OF NEW BRUNSWICK   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CATALYSIS; COMPUTER SIMULATION; CURING; DIFFERENTIAL SCANNING CALORIMETRY; DIFFUSION; HIGH TEMPERATURE EFFECTS; ITERATIVE METHODS; MATHEMATICAL MODELS; REACTION KINETICS; THERMOSETS;

CURE KINETICS; THERMOSETTING MATERIALS;

EPOXY RESINS;

EID: 1542711663     PISSN: 00323888     EISSN: None     Source Type: Journal    
DOI: 10.1002/pen.10001     Document Type: Article

References (23)

1. M. R. Kamal, Polym. Eng. Sci., 14, 231 (1974).
2. S-N. Lee, M-T. Chiu, and H-S. Lin, Polym. Eng. Sci., 32, 1037 (1992).
3. J. M. Kenny and A. Trivisano. Polym. Eng. Sci., 31, 1426 (1991).
4. A. Yousefi and P. G. Lafleur, Polym. Eng. Sci., 37, 757 (1997).
5. L. Nunez, F. Fraga, A. Castro, M. R. Nunez, and M. Villanueva, J. Appl. Polym. Sci., 77, 2285 (2000).
6. Thermal Characterization of Polymeric Materials, 2nd Ed., E. A. Turi, ed., 1599 (1997).
7. S. S. Zumdahl, Chemistry, 2nd Ed., M. Le Quesne and J. E. Hobbs, eds., 544 (1989).
8. M. A. Acitelli, R B. Prime, and E. Sacher, Polymer, 12, 335 (1971).
9. R. B. Prime, Polym. Eng. Sci., 13, 365 (1973).
10. M. R. Kamal and S. Sourour, Polym. Eng. Sci., 13, 59 (1973).
11. R. C. Dunne, S. K. Sitaraman, S. Luo, and C. P. Wong, 2000 Electronic Components and Technology Conference, 592 (2000).
12. M. R. Keenan, J. Appl. Polym. Sci., 33, 1725 (1987).
13. A. Atarsia and R. Boukhili, Polym. Eng. Sci., 40, 607 (2000).
14. J. Mijovic, J. Kim, and J. Slaby, J. Appl. Polym. Sci., 29, 1449 (1984).
15. J. Mijovic, J. Appl. Polym. Sci., 31, 1177 (1986).
16. M. R. Dusi, W. I. Lee, P. R. Ciriscioli, and G. S. Springer, J. Compos. Mater., 21, 243 (1987).
17. M-K. Um and I. M. Daniel, 45th International SAMPE Symposium, 1598 (2000).
18. A. Yousefi and P. G. Lafleur, J. Vinyl Addit. Technol., 3, 157 (1997).
19. D. Djokic, A. Johnston, A. Rogers, P. Lee-Sullivan, and N. Mrad, Composites: Part A, 33, 277 (2002).
20. C-S. Chern and G. W. Poehlein, Polym. Eng. Sci., 27, 788 (1987).
21. K. C. Cole, J.-J. Hechler, and D. Noel, Macromolec., 24, 3098 (1991).
22. E. Rabinowitch, Trans. Faraday Soc., 33, 1225 (1937).
23. J. M. Barton, Br. Polym. J., 18, 37 (1986).