Prediction of electrical contact resistance for anisotropic conductive adhesive assemblies

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 2, 2004, Pages 317-326

  Chin, Melida ^a   Iyer, Kaushik A ^a   Hu, S Jack ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ANISOTROPY; BONDING; CONDUCTIVE MATERIALS; ELECTRIC CONTACTS; ELECTRIC RESISTANCE; MATHEMATICAL MODELS; MICROELECTRONICS; PARTICLES (PARTICULATE MATTER);

ANISOTROPIC CONDUCTIVE ADHESIVE; BONDING FORCE; CONDUCTIVE PARTICLE; CONTACT AREA; CONTACT RESISTANCE; PACKAGING INTERCONNECTS;

ELECTRONICS PACKAGING;

EID: 3242810501     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.828565     Document Type: Article

References (18)

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