The effect of thermal cycling on the contact resistance of anisotropic conductive joints

Soldering and Surface Mount Technology

Volumn 17, Issue 3, 2005, Pages 20-31

  Ali, L ^a   Chan, Y C ^a   Alam, M O ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Joining processes; Reliability management; Thermal resistance

Indexed keywords

ANISOTROPY; GLASS TRANSITION; HEAT RESISTANCE; JOINING; RELIABILITY; THERMAL CYCLING; THERMAL EXPANSION; THIN FILMS;

INCUBATION; JOINING PROCESSES; RELIABILITY MANAGEMENT; THERMAL WARPAGES;

SOLDERED JOINTS;

EID: 22544464712     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910510613529     Document Type: Article

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