Conductive adhesives for solder replacement in electronics packaging

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2000, Pages 24-31

  Lu, Daoqiang ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; CONDUCTIVE PLASTICS; CORROSION INHIBITORS; ELECTRIC RESISTANCE; EPOXY RESINS; PLASTIC ADHESIVES; POLYURETHANES; RUBBER; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; THERMAL EFFECTS; TIN ALLOYS;

ELECTRICALLY CONDUCTIVE ADHESIVES (ECA);

ELECTRONICS PACKAGING;

EID: 0033699156     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (22)