Degradation mechanism and reliability of flip chip interconnects using anisotropic conductive adhesives for high current density packaging applications

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 338-343

  Yim, Myung Jin ^a   Kim, Hyoung Joon ^a   Chung, Chang Kyu ^a   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; ANISOTROPY; CURRENT DENSITY; DEGRADATION; GOLD; INORGANIC POLYMERS; INTERFACES (MATERIALS); SILICON CARBIDE; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

ANISOTROPIC CONDUCTIVE ADHESIVES (ACA); CONDUCTIVE FILLERS; CURRENT STRESSING; FLIP CHIP INTERCONNECTS; HIGH CURRENT DENSITY PACKAGING APPLICATIONS;

FLIP CHIP DEVICES;

EID: 33845565393     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645668     Document Type: Conference Paper

References (9)

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