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Volumn 115, Issue 49, 2011, Pages 24353-24365

Structural and electrical properties of flip chip laminated metal-molecule-silicon structures varying molecular backbone and atomic tether

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION INFRARED SPECTROSCOPY; AMBIENT CONDITIONS; CRITICAL FACTORS; CURRENT-VOLTAGE MEASUREMENTS; DIELECTRIC INTEGRITY; ELECTRICAL CONTACTS; ELECTRICAL INTEGRITY; ELECTRICAL STRUCTURES; FLIP CHIP; FUNCTIONALIZED; JUNCTION FORMATION; LOW COSTS; METAL ELECTRODES; MOLECULAR ARCHITECTURE; MOLECULAR JUNCTION; MOLECULAR TERMINALS; NANO SCALE; NANOELECTRONIC ARCHITECTURE; NON DESTRUCTIVE; ORGANIC MOLECULES; ORGANIC MONOLAYERS; PRESSURE AND TEMPERATURE; SILICON SUBSTRATES; STRUCTURAL AND ELECTRICAL PROPERTIES; SURFACE FREE ENERGY;

EID: 83455213393     PISSN: 19327447     EISSN: 19327455     Source Type: Journal    
DOI: 10.1021/jp208275c     Document Type: Article
Times cited : (10)

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