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In general, the assembly of a SAM involves a dynamic exchange between adsorbates on the surface and their precursors in free solution [Love, J. C.; Estroff, L. A.; Kriebel, J. K.; Nuzzo, R. G.; Whitesides, G. M. Chem. Rev. 2005, 105, 1103]. The composition of a SAM reflects (i) the concentration of the adsorbate species present in the solution, (ii) the strength of the intermolecular interactions among adsorbate species in solution and in the SAM, (iii) the strength of the bond between the adsorbate molecule and the metal surface, and (iv) the presence of kinetically trapped defects and disorder in the array reflecting inevitable entropic disorder.
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In general, the assembly of a SAM involves a dynamic exchange between adsorbates on the surface and their precursors in free solution [Love, J. C.; Estroff, L. A.; Kriebel, J. K.; Nuzzo, R. G.; Whitesides, G. M. Chem. Rev. 2005, 105, 1103]. The composition of a SAM reflects (i) the concentration of the adsorbate species present in the solution, (ii) the strength of the intermolecular interactions among adsorbate species in solution and in the SAM, (iii) the strength of the bond between the adsorbate molecule and the metal surface, and (iv) the presence of kinetically trapped defects and disorder in the array reflecting inevitable entropic disorder.
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We observed no correlation between the area of the junction and the magnitude of the current for the TS junctions, possibly because we varied the area of the junction by no more than a factor of 4 and usually by only a factor of 2, and there was no guarantee that the distribution of defects within every junction was similar
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We observed no correlation between the area of the junction and the magnitude of the current for the TS junctions, possibly because we varied the area of the junction by no more than a factor of 4 (and usually by only a factor of 2), and there was no guarantee that the distribution of defects within every junction was similar.
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We did not attempt to improve the quality of the AS-DEP silver substrates by evaporating them onto mica (rather than Si/SiO2) or thermally annealing before formation of the SAM
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2) or thermally annealing before formation of the SAM.
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