Nondestructive contact deposition for molecular electronics: Si-alkyl//au junctions

Journal of Physical Chemistry C

Volumn 114, Issue 29, 2010, Pages 12769-12776

  Stein, Nir ^a   Korobko, Roman ^a   Yaffe, Omer ^a   Har Lavan, Rotem ^a   Shpaisman, Hagay ^a   Tirosh, Einat ^a   Vilan, Ayelet ^a   Cahen, David ^a  

^a WEIZMANN INSTITUTE OF SCIENCE   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT AREAS; CONTACT DEPOSITION; DEPOSITION METHODS; ELECTRICAL PERFORMANCE; METAL WORK FUNCTION; MOLECULAR DEGRADATION; MOLECULAR LAYER; MORPHOLOGICAL CHARACTERIZATION; MULTIPLE CONTACTS; NON DESTRUCTIVE; PUNCH-THROUGH; SIMULTANEOUS DEPOSITION; THIN METALS;

METALS; MOLECULAR ELECTRONICS; POLYMERS;

CURRENT VOLTAGE CHARACTERISTICS;

EID: 77954889724     PISSN: 19327447     EISSN: 19327455     Source Type: Journal    
DOI: 10.1021/jp104130w     Document Type: Article

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