Metrology of molecular devices made by flip chip lamination

ECS Transactions

Volumn 28, Issue 2, 2010, Pages 549-562

  Hacker, Christina A ^a   Coll, Mariona ^a   Richter, Curt A ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTANCE; ELECTRON DEVICES; MOLECULAR ELECTRONICS; MONOLAYERS; THERMOELECTRIC EQUIPMENT;

ALTERNATE ROUTES; METAL MONOLAYERS; MOLECULAR DEVICE; MOLECULAR ELECTRONIC DEVICE; NOVEL DEVICE ARCHITECTURES; PHYSICAL LIMITS; SILICON STRUCTURES; SILICON-BASED;

FLIP CHIP DEVICES;

EID: 78650569114     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3372608     Document Type: Conference Paper

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