Thermal stability of confined flip-chip laminated ω -functionalized monolayers

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 27, Issue 6, 2009, Pages 2826-2831

  Coll, M ^a,b   Richter, C A ^a   Hacker, C A ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b Bldg 142   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALKANETHIOLS; CHEMICALLY BONDED; COOH GROUP; EFFECT OF TEMPERATURE; FLIP CHIP; FUNCTIONALIZED; GOLD SUBSTRATES; H-SI (111); IR SPECTRUM; LOW FREQUENCY REGIONS; METAL EVAPORATION; MOLECULAR JUNCTION; MOLECULAR LENGTH; ORGANIC MONOLAYERS; P-POLARIZED; REFLECTION ABSORPTION INFRARED SPECTROSCOPY; SELF-ASSEMBLED; THERMAL STABILITY;

ABSORPTION SPECTROSCOPY; CARBOXYLIC ACIDS; ELECTRON ENERGY LEVELS; FLIP CHIP DEVICES; FLUORINE CONTAINING POLYMERS; LAMINATING; MONOLAYERS; ORGANIC ACIDS; SILICON; THERMAL EFFECTS; THERMODYNAMIC STABILITY;

INFRARED SPECTROSCOPY;

EID: 72849110679     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.3259934     Document Type: Conference Paper

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