Grain deformation and strain in board level SnAgCu solder interconnects under deep thermal cycling

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 1, 2007, Pages 178-185

  Park, Seungbae ^a   Dhakal, Ramji ^a   Lehman, Lawrence ^b   Cotts, Eric J ^b  

^a State University of New York at Binghamton   (United States)

^b BINGHAMTON UNIVERSITY   (United States)

Author keywords

Digital image correlation (DIC); Fatigue life; Grain boundary; Intermetallics; SnAgCu (SAC); Thermomechanical deformation

Indexed keywords

ANISOTROPY; DEFORMATION; FATIGUE OF MATERIALS; GRAIN BOUNDARIES; IMAGE PROCESSING; INTERMETALLICS;

DEEP THERMAL CYCLING; DIGITAL IMAGE CORRELATION (DIC); GRAIN DEFORMATION; SOLDER INERCONNECTS; THERMOMECHANICAL DEFORMATION;

SOLDERED JOINTS;

EID: 34147151039     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.892101     Document Type: Article

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