Mechanical fatigue of Sn-rich Pb-free solder alloys

Journal of Materials Science: Materials in Electronics

Volumn 18, Issue 1-3, 2007, Pages 211-227

  Shang, J K ^a   Zeng, Q L ^b   Zhang, L ^b   Zhu, Q S ^b  

^a University of Illinois at Urbana Champaign   (United States)

^b INSTITUTE OF METAL RESEARCH   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; CRACK PROPAGATION; DEFORMATION; FATIGUE OF MATERIALS; GRAIN BOUNDARIES; TIN ALLOYS;

COFFIN-MASON EQUATION; CYCLIC CREEP DEFORMATION; FATIGUE CRACK GROWTH; FATIGUE DUCTILITY;

SOLDERING ALLOYS;

EID: 33845694540     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-006-9027-1     Document Type: Review

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