Bulk solder and solder joint properties for lead free 95.5Sn-3.8Ag-0.7Cu solder alloy

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 673-679

  Pang, John H L ^a   Xiong, B S ^a   Neo, C C ^a   Zhang, X R ^a   Low, T H ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ENERGY DISPERSIVE SPECTROSCOPY; MATERIALS TESTING; MICROSTRUCTURE; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; STRAIN RATE; TEMPERATURE; TENSILE STRENGTH; TENSILE TESTING; TIN ALLOYS; VACUUM;

FASTEST DISPLACEMENT RATE; LAP SHEAR SOLDER JOINT TESTS;

SOLDERING ALLOYS;

EID: 0037674774     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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