Drop impact reliability testing for lead-free and leaded soldered IC packages

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 622-629

  Chong, Desmond Y R ^a   Ng, Kellin ^a   Tan, Jane Y N ^a   Low, Patrick T H ^a   Pang, John H L ^b   Che, F X ^b   Xiong, B S ^b   Xu, Luhua ^b  

^a United Test and Assembly Center Ltd UTAC   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC PRODUCTS; LEAD-BASED SOLDERS; PLASTIC BALL GRID ARRAY (PBGA); SOLDERED ASSEMBLIES;

CHARACTERIZATION; ELECTRONICS ENGINEERING; FAILURE ANALYSIS; GOLD; NICKEL; RELIABILITY; SOLDERING ALLOYS;

ELECTRONICS PACKAGING;

EID: 24644481526     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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