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Volumn 38, Issue 12, 2009, Pages 2461-2469

The crystal orientation of β-Sn grains in Sn-Ag and Sn-Cu solders affected by their interfacial reactions with Cu and Ni(P) under bump metallurgy

(5) Seo, Sun Kyoung a Kang, Sung K b Cho, Moon Gi a Shih, Da Yuan b Lee, Hyuck Mo a

a Korea Advanced Institute of Science and Technology (KAIST) (South Korea)

b IBM T J WATSON RESEARCH CENTER (United States)

Author keywords

Sn grains; Electron backscatter diffraction (EBSD); Interfacial reaction; Pb free solders

Indexed keywords

ALLOY COMPOSITIONS; COMPOSITIONAL ANALYSIS; CROSS POLARIZATIONS; ELECTRON BACK SCATTER DIFFRACTION; GRAIN SIZE; INTERFACIAL REACTIONS; LIGHT MICROSCOPY; NI ATOMS; PB FREE SOLDERS; PURE SN; SN GRAINS; SN-CU SOLDERS; SOLDER BALLS; SOLDER JOINTS; SOLUBILITY LIMITS; THERMOMECHANICAL FATIGUE; UNDER-BUMP METALLURGIES; WEIGHT PERCENT;

ALLOYING; BACKSCATTERING; COPPER ALLOYS; CRYSTAL ORIENTATION; DISSOLUTION; ELECTRON DIFFRACTION; ELECTRONS; GRAIN SIZE AND SHAPE; LEAD; LIGHT; MICROSTRUCTURE; NICKEL; POLYCRYSTALLINE MATERIALS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 72549084705 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0902-4 Document Type: Article

Times cited : (62)

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