SCOPUS 정보 검색 플랫폼

Materials Transactions

Volumn 45, Issue 3, 2004, Pages 689-694

Low cycle fatigue properties of Ni added low silver content Sn-Ag-Cu flip chip interconnects

(5) Kariya, Yoshiharu a Hosoi, Takuya b Kimura, Takashi a Terashima, Shinichi c Tanaka, Masamoto c

a NATIONAL INSTITUTE FOR MATERIALS SCIENCE (Japan)

b SHIBAURA INSTITUTE OF TECHNOLOGY (Japan)

c NIPPON STEEL CORPORATION (Japan)

Author keywords

Ball grid Array (BGA) joints; Fatigue life; Flip chip; Lead free solder; Low silver content; Nickel addition; Shear fatigue; Tin silver copper

Indexed keywords

DUCTILITY; EUTECTICS; FATIGUE OF MATERIALS; FATIGUE TESTING; INTERMETALLICS; MICROSTRUCTURE; PLASTIC DEFORMATION; SOLDERING ALLOYS; STRAIN; STRAIN HARDENING; TIN ALLOYS;

BALL GRID ARRAY (BGA) JOINTS; LEAD-FREE CONTENT; LOW SILVER CONTENT; NICKEL ADDITION; SHEAR FATIGUE; TIN-SILVER-COPPER;

FLIP CHIP DEVICES;

EID: 2442586386 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.45.689 Document Type: Article

Times cited : (14)

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