Effect of silver content and nickel dopant on mechanical properties of Sn-Ag-based solders

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 485-490

  Che, F X ^a   Luan, J E ^a   Baraton, Xavier ^a  

^a STMICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ARSENIC COMPOUNDS; BRAZING; COMPUTER NETWORKS; COPPER; COPPER ALLOYS; GRAIN SIZE AND SHAPE; INTERMETALLICS; LEAD; MECHANICAL PROPERTIES; METALLIC COMPOUNDS; MICROSTRUCTURE; NICKEL; NICKEL ALLOYS; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; STRESSES; TENSILE TESTING; TIN ALLOYS; WELDING; YIELD STRESS;

MATE RIAL PROPERTIES;

TIN;

EID: 51349150879     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550016     Document Type: Conference Paper

References (12)

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