Grain formation and intergrain stresses in a Sn-Ag-Cu solder ball

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART B, Issue , 2005, Pages 1095-1100

  Park, Seungbae ^a   Dhakal, Ramji ^a   Lehman, Lawrence ^b   Cotts, Eric ^b  

^a State University of New York   (United States)

^b BINGHAMTON UNIVERSITY   (United States)

Author keywords

CBGA; Cross polarized microscopy; Digital image correlation; Fatigue life; Grain boundary; Intergrain stresses; Pb free; PBGA; SnAgCu

Indexed keywords

COPPER; DEFORMATION; GRAIN BOUNDARIES; IMAGE ANALYSIS; OPTICAL MICROSCOPY; SILVER; STRAIN MEASUREMENT; STRESS ANALYSIS; TIN;

CROSS POLARIZED MICROSCOPY; DIGITAL IMAGE CORRELATION; INTERGRAIN STRESSES; PB-FREE; PBGA; SNAGCU;

SOLDERING;

EID: 32844475184     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73058     Document Type: Conference Paper

References (7)

1. Donald W. Henderson et al, "The Microstructure of Sn in Near Eutectic Sn-Ag-Cu Alloy Solder Joints and Its Role In Thermomechanical Fatigue", J. Mater. R., 19, (6), 2004, pp 1608-1612.
2. S.B. Park, Ramji Dhakal and Rahul Joshi, " Comparative Analysis of BGA Deformations and Strains Using Digital Image Correlation and Moire Interferometry", accepted for publication in Society for Experimental Mechanics, 2005.
3. 0.7 solder joints", Journal of materials research, Vol. 16, No. 10, Oct2001, pp 2914-2921.
4. A. U. Telang, T. R. Bieler, J. P. Lucas, K. N. Subramanian, L. P. Lehman, Y. Xing and E. J. Cotts, "Grain Boundary Character and Grain Growth in Bulk Tin and Bulk Lead-free Solder Alloys", Joumal-of-Electronic-Materials. Dec. 2004: 33(12): 1412-23
5. K. N. Subramanian, J. G. Lee, " Effect of Anisotropy of Tin on Thermomechanical Behavior of Solder Joints", Journal of Materials Science: Materials in Electronics 15 (2004) pp 235-240.
6. http://www.minco.coni/products/heaters.aspx
7. L.P. Lehman, S.N. Athavale, T.Z. Fullem, A.C. Giamis, R.K. Kinyanjui, M. Lowenstein, K. Mather, R. Patel, D. Rae, J. Wang, Y. Xing, L. Zavalij, P. Borgesen and E.J. Cotts, "Growth of Sn and Intermetallic Compounds in Sn-Ag-Cu Solder", Journal of Electronic Materials, Vol. 33, No. 12, 2004, pp 1429-1439.