Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint

Acta Materialia

Volumn 55, Issue 7, 2007, Pages 2265-2277

  Telang, A U ^a   Bieler, T R ^a   Zamiri, A ^a   Pourboghrat, F ^a  

^a Michigan State University   (United States)

Author keywords

Dislocation boundaries; Electron backscatter patterns; Low cycle fatigue; Recrystallization texture; Soldering

Indexed keywords

FATIGUE OF MATERIALS; RECRYSTALLIZATION (METALLURGY); SOLDERED JOINTS; STRAIN ENERGY; THERMOMECHANICAL TREATMENT;

DISLOCATION BOUNDARIES; ELECTRON BACKSCATTER PATTERNS; LOW CYCLE FATIGUE; RECRYSTALLIZATION TEXTURE;

GRAIN GROWTH;

EID: 33947270518     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2006.11.023     Document Type: Article

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