Effects of Mechanical Deformation and Annealing on the Microstructure and Hardness of Pb-Free Solders

Journal of Electronic Materials

Volumn 32, Issue 12, 2003, Pages 1432-1440

  Lauro, Paul ^a   Kang, Sung K ^a   Choi, Won Kyoung ^b   Shih, Da Yuan ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Annealing; Compressive deformation; Grain growth; Mechanical property; Microhardness; Microstructure; Pb free solders; Pure Sn, Sn 0.7 Cu; Recrystallization; Sn 3.5 Ag; Sn 3.8 Ag 0.7 Cu

Indexed keywords

ANNEALING; COOLING; CRYSTALLIZATION; GRAIN GROWTH; METALLOGRAPHY; MICROHARDNESS; MICROSTRUCTURE; NUCLEATION; PLASTIC DEFORMATION; SOLDERED JOINTS; STRAIN; THERMOMECHANICAL TREATMENT; TIN ALLOYS;

COMPRESSIVE DEFORMATION; PB-FREE SOLDERS; PURE SN,SN-0.7; RECRYSTALLIZATION; SN-3.5; SN-3.8;

SOLDERING ALLOYS;

EID: 0942299492     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0112-4     Document Type: Conference Paper

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