Identification of mechanical properties of intermetallic compounds on lead-free solder

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 687-691

  Tsai, Iting ^a   Tai, Li Jung ^a   Yen, S F ^a   Chuang, T H ^a   Lo, Robert ^b   Ku, Terry ^c   Wu, Enboa ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^c VIA Technologies Inc   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; ELASTIC MODULI; INTERFACES (MATERIALS); LEAD; MECHANICAL PROPERTIES; SOLDERING ALLOYS;

SILICON SUBSTRATES; SLOPE MEASUREMENT; WETTING PROBLEMS;

INTERMETALLICS;

EID: 24644512312     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Jie-Hua Zhao, Yong Du, Michael Morgen, and Paul S. Ho, "Simultaneous Measurement of Young's Modulus, Poisson Ratio, and Coefficient of Thermal Expansion of Thin Films on Substrates," Journal of Applied Physics, Vol. 87, No. 3 (2000), pp. 1575-1577.
2. K. N. Tu, "Cu/Sn Interfacial Reactions: Thin-Film Case Versus Bulk Case," Materials Chemistry and Physics, Vol. 46 (1996), pp. 217-223.
3. Daniel Royer and Eugene Dieulesaint, Elastic Waves in Solids I, Springer (Berlin, 2000), pp. 148.
4. Wu, E., Yang J. D.,and Shao, C. A, "Simultaneous determining Young's Modulus, Coefficient of Thermal Expansion, Poisson Ratio and Thickness of Thin Films on Silicon Wafer," Electronic Components and Technology Conf., June. 2004, pp. 901-905.
5. R. R. Chromik, R. P. Vinci, S. L. Allen, and M. R. Notis, "Nanoindentation Measurements on Cu-Sn and Ag-Sn Intermetallics Fromed in Pb-Free Solder Joints," Journal of Materials Research, Vol. 18, No. 9 (2003), pp. 2251-2261.
6. I-Ting Tsai, L. J. Tai, Enboa Wu, S. F. Yen, and T. H. Chuang, "Identification of the Young's Modulus of Intermetallic Compounds Formed During Soldering Eutectic Sn-9Zn with Cu Substrates," IMAPS Taiwan Conference, 2004.
7. C. A. Sciammarella, "The Moire Method - A Review," Experimental Mechanics, November (1982), pp. 418-433.
8. J. S. Kang, R. A. Gagliano, G. Ghosh, and M. E. Fine, "Isothermal Solidification of Cu/Sn Diffusion Couples to Form Thin-Solder Joints," Journal of Electronic Materials, Vol. 31, No. 11 (2002), pp. 1238-1243.