Influence of Sn grain size and orientation on the thermomechanical response and reliability of Pb-free solder joints

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 2 SPEC. ISS., 2008, Pages 370-381

  Bieler, Thomas R ^a   Jiang, Hairong ^a   Lehman, Lawrence P ^b   Kirkpatrick, Tim ^c   Cotts, Eric J ^b   Nandagopal, Bala ^d  

^a Michigan State University   (United States)

^b BINGHAMTON UNIVERSITY   (United States)

^c BOSTON COLLEGE   (United States)

^d CISCO SYSTEMS   (United States)

Author keywords

Sn Ag Cu near eutectic alloys (SAC)

Indexed keywords

BASAL PLANES; CO-EFFICIENT OF THERMAL EXPANSIONS; CRACK NUCLEATIONS; DIFFERENTIAL EXPANSIONS; JOINT INTERFACES; PB-FREE; PB-FREE SOLDERS; RECRYSTALLIZATION; SN GRAINS; SN-AG-CU NEAR EUTECTIC ALLOYS (SAC); SN-AG-CU SOLDERS; SOLDER BALLS; SOLDER JOINTS; TENSILE STRESS MODES; TETRAGONAL CRYSTAL STRUCTURES; THERMAL CYCLES; THERMO MECHANICALS; THERMO-MECHANICAL FATIGUES; TWIN RELATIONSHIPS;

BRAZING; COPPER ALLOYS; CRYSTAL ORIENTATION; EUTECTICS; LEAD; LEAD ALLOYS; POLYCRYSTALLINE MATERIALS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; THERMAL EXPANSION; THERMAL STRESS; THERMOMECHANICAL TREATMENT; TIN ALLOYS; WELDING;

TIN;

EID: 58349085169     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.916835     Document Type: Conference Paper

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