A study of nano particles in SnAg-based lead free solders for intermetallic compounds and drop test performance

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1170-1190

  Amagai, Masazumi ^a  

^a Texas Instruments Japan Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

HARDNESS; INTERMETALLICS; SEMICONDUCTOR GROWTH; SOLDERED JOINTS; TIN COMPOUNDS;

DROP TEST PERFORMANCE; NANO PARTICLE EFFECTS; SOLDER BALL HARDNESS;

NANOSTRUCTURED MATERIALS;

EID: 33845586688     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645802     Document Type: Conference Paper

References (2)

1. Masazumi Amagai, Yoshitaka Toyoda and Takeshi Tashima, " High Solder Joint Reliability with Lead Free Solders ", Proceedings of the IEEE 53 rd Electronic Components and Technology Conference, 2003, pp317-322.
2. Masazumi Amagai, Yoshitaka Toyoda, Tsukasa Ohnishi, Satoru Akita, " High Drop Test Reliability: Lead-free Solders ", Proceedings of the IEEE 54 th Electronic Components and Technology Conference, USA, 2004, pp1304-1309.