Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 684-688

  Kobayashi, Takayuki ^a   Kariya, Yoshiharu ^b   Sasaki, Tsutomu ^a   Tanaka, Masamoto ^a   Tatsumi, Kohei ^a  

^a NIPPON STEEL CORPORATION   (Japan)

^b SHIBAURA INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); CRACK PROPAGATION; FATIGUE OF MATERIALS; FATIGUE TESTING; NICKEL;

NI ADDITION; SUBSTRATE DISPLACEMENT; THREE POINT BENDING TESTS;

SOLDERED JOINTS;

EID: 35348910719     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373870     Document Type: Conference Paper

References (12)

1. C. M. Miller et al, "A Viable Tin-Lead Solder Substitute: Sn-Ag-Cu," J. Electron Mater. Vol. 23, No. 7 (1994), pp. 595-602.
2. D. R. Frear, "Mechanical behavior of interconnect materials for electronic packaging," JOM. Vol. 48, No. 5 (1996), pp. 49-53.
3. H. Mavoori et al, "Creep, Stress Relaxation, and Plastic Deformation in Sn-Ag and Sn-Zn Eutectic Solders," J. Electron. Mater. Vol. 26, No. 7 (1997), pp. 783-790.
4. Y. R. Desmond et al, "Drop impact reliability testing for lead-free and lead-based solder IC packages," Microelectron. Reliab. Vol. 46, No. (2006), pp. 1160-1171.
5. C. L. Yeh et al, "Evaluation of board-level reliability of electronic packages under consecutive drops," Microelectron. Reliab. Vol. 46, No. (2006), pp. 1172-1182.
6. th Electronic Components and Technology Conf, San Diego, CA, May. 2006, pp. 78-84
7. th Electronic Components and Technology Conf, New Orleans, Louisiana, May. 2006, pp. 78-84.
8. C. U. Kim et al, "Bending fatigue test as a reliability evaluation method for solder joints," JOM. Vol. 56, No. 11 (2004), pp. 303.
9. S. Terashima et al, "Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition," Mater. Trans. Vol.45, No. 3 (2004), pp. 673-680.
10. Y. Kariya et al, "Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu-Flip Chip Interconnects," Mater. Trans. Vol. 45, No. 3 (2004), pp. 689-694.
11. S. Terashima et al, "Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder," Mater. Trans. Vol. 45, No. 4 (2004), pp. 1383-1390.
12. Y. Kariya et al, "Mechanical Properties of Lead Free Solder Alloys Evaluated by Miniature Size Specimen," TMS Lett. Vol. 1, Issue 8 (2004), pp. 169-170