Thermal fatigue properties of Sn-1.2Ag-0.5Cu-xNi flip chip interconnects

Materials Transactions

Volumn 45, Issue 3, 2004, Pages 681-688

  Terashima, Shinichi ^a   Tanaka, Masamoto ^a  

^a NIPPON STEEL CORPORATION   (Japan)

Author keywords

Crack propagation; Flip chip; Lead free; Microjoining; Microstructure; Nickel; Reliability; Silver; Solder; Thermal fatigue; Tin

Indexed keywords

CRACK PROPAGATION; CRACKS; ENERGY DISPERSIVE SPECTROSCOPY; FATIGUE OF MATERIALS; GRAIN GROWTH; MICROSTRUCTURE; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; SOLDERING ALLOYS; STRAIN; THERMAL CYCLING; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY;

FLIP CHIP INTERCONNECTS; LEAD-FREE; MICROJOINING;

FLIP CHIP DEVICES;

EID: 2442422062     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.45.681     Document Type: Article

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