Effect of anisotropy of tin on thermomechanical behavior of solder joints

Journal of Materials Science: Materials in Electronics

Volumn 15, Issue 4, 2004, Pages 235-240

  Subramanian, K N ^a   Lee, J G ^a  

^a Michigan State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; CRACK INITIATION; FATIGUE OF MATERIALS; GRAIN BOUNDARIES; LATTICE CONSTANTS; MATHEMATICAL MODELS; STRESSES; TEMPERATURE; THERMAL EXPANSION; TIN;

BODY CENTERED TETRAGONAL TIN; GRAIN BOUNDARY SLIDING; SURFACE RELIEF EFFECTS; TEMPERATURE EXCURSIONS; THERMOMECHANICAL FATIGUE;

SOLDERED JOINTS;

EID: 1542397798     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/B:JMSE.0000012461.69417.75     Document Type: Article

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