SCOPUS 정보 검색 플랫폼

Science and Technology of Advanced Materials

Volumn 3, Issue 3, 2002, Pages 261-270

TEM observation of interfaces in a solder joint in a semiconductor device

(3) Matsuki, Hirohisa a Ibuka, Hiroshi b Saka, Hiroyasu b

Author keywords

Ball grid array; Electroless Ni; Eutectic solder; Fracture; Kirkendall voids; Semiconductor package; Solder joint; Transmission electron microscopy

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; EUTECTICS; FRACTURE; INTERFACES (MATERIALS); MICROSTRUCTURE; MULTILAYERS; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

EUTECTIC SOLDERS;

SEMICONDUCTOR DEVICES;

EID: 0036613819 PISSN: 14686996 EISSN: None Source Type: Journal
DOI: 10.1016/S1468-6996(02)00025-6 Document Type: Article

Times cited : (72)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.