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Volumn 60, Issue 5, 2009, Pages 333-335
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Initial formation of CuSn intermetallic compounds between molten SnAgCu solder and Cu substrate
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Author keywords
Electronic packaging; Interfacial intermetallics; Pb free solder; Wetting
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Indexed keywords
BRAZING;
CHIP SCALE PACKAGES;
COPPER;
ELECTRONIC EQUIPMENT MANUFACTURE;
ELECTRONICS PACKAGING;
FORMING;
INTERMETALLICS;
LEAD;
LEAD ALLOYS;
LIQUIDS;
SEMICONDUCTING INTERMETALLICS;
SOLDERING ALLOYS;
SUBSTRATES;
WELDING;
WETTING;
BUMP METALLIZATION;
CU SUBSTRATES;
CUSN INTERMETALLICS;
ELECTRONIC PACKAGING;
INTERFACIAL INTERMETALLICS;
INTERMETALLIC COMPOUNDS;
LIQUID PHASE;
LIQUID SOLDERS;
PB-FREE SOLDER;
SNAGCU ALLOYS;
SNAGCU SOLDERS;
TIN;
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EID: 57949099111
PISSN: 13596462
EISSN: None
Source Type: Journal
DOI: 10.1016/j.scriptamat.2008.10.029 Document Type: Article |
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Times cited : (57)
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References (11)
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