Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders

Journal of Materials Research

Volumn 17, Issue 2, 2002, Pages 263-266

  Chen, W T ^a   Ho, C E ^a   Kao, C R ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; EUTECTICS; INTERMETALLICS; ISOTHERMS; SURFACE CHEMISTRY; SURFACE REACTIONS; TIN;

INTERFACIAL REACTIONS;

SOLDERING ALLOYS;

EID: 0036477472     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2002.0036     Document Type: Article

References (6)