Effect of solid-state intermetallic growth on the fracture toughness of Cu/63Sn-37Pb solder joints

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 1, 1996, Pages 134-141

  Pratt, Ronald E ^a   Stromswold, Eric I ^b   Quesnel, David J ^c  

^a IEC Electronics Corp   (United States)

^b Aspen Test Engineering Inc   (United States)

^c University of Rochester   (United States)

Author keywords

Cleavage; Copper; Fracture toughness; Intermetallics; Microvoids; Solder

Indexed keywords

COPPER ALLOYS; FAILURE (MECHANICAL); FRACTURE TOUGHNESS; INTERFACES (MATERIALS); INTERMETALLICS; MORPHOLOGY; PARTICLES (PARTICULATE MATTER); THICKNESS MEASUREMENT;

CHEVRON NOTCH FRACTURE TOUGHNESS; MICROVOIDS; SOLID STATE INTERMETALLIC GROWTH;

SOLDERED JOINTS;

EID: 0030106421     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.486625     Document Type: Article

References (12)

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