Influence of Au Addition on the Phase Equilibria of Near-Eutectic Sn-3.8Ag-0.7Cu Pb-Free Solder Alloy

Journal of Electronic Materials

Volumn 32, Issue 12, 2003, Pages 1474-1482

  Park, Jae Yong ^a   Kabade, Rajendra ^a   Kim, Choong Un ^a   Carper, Ted ^b   Dunford, Steven ^b   Puligandla, Viswanadham ^b  

^a The University of Texas at Arlington   (United States)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

Au embrittlement; Au Cu Sn intermetallic; Interface reaction; Pb free solder; Phase equilibria; Sn Ag Cu

Indexed keywords

COMPOSITE MATERIALS; EMBRITTLEMENT; EUTECTICS; GOLD; INTERMETALLICS; MICROSTRUCTURE; OXIDATION; PHASE EQUILIBRIA; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; SOLDERING; STRENGTH OF MATERIALS; SURFACE REACTIONS;

AU EMBRITTLEMENT; AU-CU-SN INTERMETALICS; PB-FREE SOLDERS; SN-AG-CU;

SOLDERING ALLOYS;

EID: 0942266963     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0117-z     Document Type: Conference Paper

References (11)

1. J. Bath, C. Handwerker, and E. Bradley, Circuits Assembly 11, 31 (2000).
2. D.M. Jacobson and G. Jumpston, Gold Bull. 22, 9 (1989).
3. J.H. Lee, J.H. Park, D.H. Shin, Y.H. Lee, and Y.S. Kim, J. Electron. Mater. 30, (2001).
4. C.E. Ho, Y.M. Chen, and C.R. Kao, J. Electron. Mater. 28, 1231 (1999).
5. P.G. Kim and K.N. Tu, Mater. Chem. Phys. 53, 165 (1998).
6. J.-Y. Park, C.-U. Kim, T. Carper, and V. Puligandla, J. Electron. Mater. 32, 1297 (2003).
7. K.W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, and C.A. Handwerker, J. Electron. Mater. 29, 1122 (2000).
8. S. Haasam, M. Gambino, M. Gaune-Escard, J.P. Bros, and J. Agren, Metall. Trans. A 19, 409 (1988).
9. P.Y. Chevelier, Thermochimica Acta 130, 1 (1988).
10. B. Sundman, G. Fries, and A. Oates, Calphad 22, 335 (1998).
11. Y.-M. Muggianu, M. Gambino, and J.-P. Bros, J. Chim. Phys. 72, 85 (1975).