Cu-Ni-Sn: A key system for lead-free soldering

Journal of Electronic Materials

Volumn 38, Issue 1, 2009, Pages 10-24

  Schmetterer, C ^a   Flandorfer, H ^a   Luef, Ch ^a   Kodentsov, A ^a   Ipser, H ^a  

^a UNIVERSITY OF VIENNA   (Austria)

Author keywords

Cu Ni Sn; Isothermal section; Lead free solder; Phase diagram; Phase equilibria

Indexed keywords

COMPREHENSIVE LITERATURES; CONTACT MATERIALS; CU-NI-SN; ISOTHERMAL SECTION; KEY SYSTEMS; LEAD-FREE; LEAD-FREE SOLDER; QUATERNARY SYSTEMS; SOLDER ALLOYS; TERNARY COMPOUNDS; TERNARY SOLUBILITIES; X-RAY DIFFRACTIONS;

BRAZING; COPPER; ELECTRON PROBE MICROANALYSIS; ISOTHERMS; LEAD; METALLIC COMPOUNDS; MICROANALYSIS; NICKEL; PHASE DIAGRAMS; PHASE EQUILIBRIA; SCANNING ELECTRON MICROSCOPY; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; SOLUBILITY; TERNARY ALLOYS; TERNARY SYSTEMS; WELDING; X RAY ANALYSIS;

TIN;

EID: 57649232810     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0522-4     Document Type: Conference Paper

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