SCOPUS 정보 검색 플랫폼

Materials Chemistry and Physics

Volumn 71, Issue 3, 2001, Pages 255-271

Microstructure evolution in Sn-Bi and Sn-Bi-Cu solder joints under thermal aging

(2) Miao, Hui Wei a Duh, Jenq Gong a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

Interfacial morphology; Intermetallic compound; Microstructure; Solder; Thermal aging

Indexed keywords

AGING OF MATERIALS; BINARY ALLOYS; COPPER ALLOYS; EUTECTICS; INTERFACES (MATERIALS); INTERMETALLICS; METALLIZING; METALLOGRAPHIC MICROSTRUCTURE; MORPHOLOGY; SILVER ALLOYS; TERNARY SYSTEMS; TIN ALLOYS;

COARSENING; INTERFACIAL MORPHOLOGY;

SOLDERED JOINTS;

EID: 0035840417 PISSN: 02540584 EISSN: None Source Type: Journal
DOI: 10.1016/S0254-0584(01)00298-X Document Type: Article

Times cited : (154)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.