Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate

Acta Materialia

Volumn 56, Issue 16, 2008, Pages 4291-4297

  Gong, Jicheng ^a   Liu, Changqing ^b   Conway, Paul P ^b   Silberschmidt, Vadim V ^b  

^a UNIVERSITY OF OXFORD   (United Kingdom)

^b LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Interface wetting; Intermetallic compounds; Soldering

Indexed keywords

ARSENIC COMPOUNDS; BRAZING; CHLORINE COMPOUNDS; COPPER; COPPER ALLOYS; FLIP CHIP DEVICES; INTERMETALLICS; METALS; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; WELDING;

CU SUBSTRATES; CU-SN INTERMETALLICS; FORMATION CHARACTERISTICS; INTERFACE WETTING; INTERMETALLIC COMPOUNDS; LIQUID SOLDERS; SN-AG-CU ALLOYS; SN-AG-CU SOLDER; SOLDERING PROCESSES; SOLDERING REACTIONS; UNDER-BUMP METALLIZATION;

SOLDERING;

EID: 50149095299     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2008.04.063     Document Type: Article

References (11)

1. Tu K.N., and Zeng K. Mater Sci Eng R 34 (2001) 1
2. Laurila T., Vuorinen V., and Kivilahti J.K. Mater Sci Eng R 49 (2005) 1
3. Hayashi A., Kao C.R., and Chang Y.A. Scripta Mater 37 (1997) 393
4. Yu C., and Lin K. Chem Phys Lett 418 (2006) 433
5. Umantsev A. J Appl Phys 101 (2007) 024910
6. Huang M.L., Loeher T., Ostmann A., and Reichl H. Appl Phys Lett 86 (2005) 181908
7. Alam M.O., Chan Y.C., and Tu K.N. J Appl Phys 94 (2003) 7904
8. Gorlich J., Schmitz G., and Tu K.N. Appl Phys Lett 86 (2005) 053106
9. Ma D., Wang W.D., and Lahiri S.K. J Appl Phys 91 (2002) 3312
10. Lord R.A., and Umantsev A. J Appl Phys 98 (2005) 063525
11. Tu N.K., Lee T.Y., Jang J.W., Li L., Frear D.R., Zeng K., et al. J Appl Phys 89 (2001) 4843