Evolution of interfacial morphology of Sn-8.5Zn-0.5Ag-0.1Al-xGa/Cu system during isothermal aging

Journal of Alloys and Compounds

Volumn 456, Issue 1-2, 2008, Pages 466-473

  Liu, Nai Shuo ^a   Lin, Kwang Lung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Aging process; Interfacial morphology; Pb free solder; Sn Zn

Indexed keywords

ALUMINUM COMPOUNDS; GALLIUM COMPOUNDS; INTERMETALLICS; SILVER COMPOUNDS; SURFACE CHEMISTRY; THERMAL AGING; TIN COMPOUNDS; ZINC COMPOUNDS;

AGING PROCESSES; AGING TREATMENT; INTERFACIAL MORPHOLOGY; PB FREE SOLDERS;

SURFACE MORPHOLOGY;

EID: 41549150363     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2007.02.135     Document Type: Article

References (29)

1. Yang W., and Messler Jr. R.W. J. Electron. Mater. 23 (1994) 765
2. Mavoori H., Chin J., Vaynman S., Moran B., Keer L., and Fine M.E. J. Electron. Mater. 41 (1997) 1269
3. McCormack M., Jin S., and Kammlott G.W. Proceedings of the 1995 IEEE International Symposium on Electronics and the Enviornment, ISEE. Orlando, FL, USA, May 1-3 (1995) 171
4. Xiao L., Liu J., Lai Z., Ye L., and Tholen A. Proceedings International Symposium on Advanced Packaging Materials: Processes Properties and Interfaces. IEEE Broselton Piscataway, NJ (2000) 145-151
5. Huang C.W., and Lin K.L. J. Mater. Res. 18 (2003) 1528
6. Lin K.L., Wen L.H., and Liu T.P. J. Electron. Mater. 27 (1998) 97
7. Lin K.L., and Wen L.H. J. Mater. Sci. Mater. Electron. 9 (1998) 5
8. Lin K.L., and Liu T.P. Oxid. Met. 50 (1998) 255
9. Lin K.L., and Wang Y.C. J. Electron. Mater. 27 (1998) 1205
10. Lin K.L., and Hsu H.M. J. Electron. Mater. 30 (2001) 1068
11. Raeder C.H., Felton L.E., Tanzi V.A., and Knorr D.B. J. Electron. Mater. 23 (1994) 611
12. McCormack M., Jin S., Chen H.S., and Machusak D.A. J. Electron. Mater. 23 (1994) 687
13. Yu S.P., Wang H.C., Hon M.H., and Wang M.C. JOM 36 (2000) 36
14. Yu S.P., Wen L.H., and Liu T.P. J. Mater. Res. 16 (2001) 76
15. Lin K.L., and Liu T.P. Mater. Chem. Phys. 56 (1998) 171
16. Date M., Tu K.N., Shoji T., Fujiyoshi M., and Sato K. J. Mater. Res. 19 (2004) 2887
17. Lee C.B., Jung S.B., Shin Y.E., and Shur C.C. Mater. Trans. 43 (2002) 1858
18. Tu P.L., Chan Y.C., Hung K.C., and Lai J.K.L. Scripta Mater. 44 (2001) 317
19. Huang C.W., and Lin K.L. J. Mater. Res. 19 (2004) 3560
20. Hultgren R., Desai P.D., Hawkins D.T., Gleiser M., and Kelley K.K. Selected Values of the Thermodynamic Properties of Binary Alloys (1973), American Society for Metals, Ohio
21. Huang C.W., and Lin K.L. Mater. Trans. 45 (2004) 1
22. Shackelford J.F., Alexander W., and Park J.S. Materials Science and Engineering Handbook (1994), CRC Press, Boca Raton
23. Kim D.G., and Jung S.B. J. Alloys Compd. 386 (2005) 151
24. Lee C.Y., and Lin K.L. J. Mater. Sci. Mater. Electron. 24 (1997) 377
25. Song J.M., Liu P.C., Shih C.L., and Lin K.L. J. Electron. Mater. 34 (2005) 1249
26. Petzow G., and Effenberg G. Ternary Alloys: A Comprehensive Compendium of Evaluated Constitutional Data and Phase Diagrams (1988), VCH, Weinheim
27. Yu C., and Lin K.L. J. Mater. Res. 20 (2005) 1242
28. Liu N.S., and Lin K.L. Scripta Mater. 54 (2006) 219
29. Shackelford J.F. Introduction to Materials Science for Engineering. 2nd ed. (1988), Macmillan Publishing Company, New York p. 690