Effects of Cu, Ag and Sb on the creep-rupture strength of lead-free solder alloys

Journal of Electronic Materials

Volumn 30, Issue 9, 2001, Pages 1228-1231

  Wade, Noboru ^a   Wu, Kepeng ^b   Kunii, Johji ^b   Yamada, Seiji ^a   Miyahara, Kazuya ^b  

^a Topy Industries Ltd   (Japan)

^b NAGOYA UNIVERSITY   (Japan)

Author keywords

Creep rate; Creep rupture strength; Intermetallic compounds; Lead free solder alloy; Microstructure; TEM observation

Indexed keywords

ADDITION REACTIONS; CREEP TESTING; INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE; OPTICAL MICROSCOPY; SILVER; STRENGTH OF MATERIALS; STRESSES; TEMPERATURE; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY;

CREEP RATE; CREEP RUPTURE STRENGTH; LEAD FREE SOLDER ALLOY;

SOLDERING ALLOYS;

EID: 0035455208     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-001-0154-4     Document Type: Article

References (7)