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Volumn 42, Issue 5, 2001, Pages 794-802
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Influence of interfacial reaction on reliability of QFP joints with Sn-Ag based Pb free solders
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Author keywords
High temperature exposure; Interfacial reaction layer; Joint strength; Lead free solders; Quad flat packages; Reflow soldering; Reliability; Tin silver based solders
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Indexed keywords
DEGRADATION;
GRAIN BOUNDARIES;
HIGH TEMPERATURE EFFECTS;
METALLOGRAPHIC MICROSTRUCTURE;
RELIABILITY;
SCANNING ELECTRON MICROSCOPY;
STRENGTH OF MATERIALS;
TIN ALLOYS;
INTERFACIAL REACTION;
QUAD FLAT PACKAGES;
REFLOW SOLDERING;
TIN SILVER BASED SOLDERS;
SOLDERED JOINTS;
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EID: 0034944912
PISSN: 13459678
EISSN: None
Source Type: Journal
DOI: 10.2320/matertrans.42.794 Document Type: Article |
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Times cited : (34)
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References (6)
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