Coupling effect in Pt/Sn/Cu sandwich solder joint structures

Acta Materialia

Volumn 55, Issue 10, 2007, Pages 3327-3335

  Wang, S J ^a   Liu, C Y ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

Bonding; Packaging; Pb free solder; Soldering

Indexed keywords

PACKAGING; PLATINUM; SANDWICH STRUCTURES; SOLDERING; SURFACE CHEMISTRY;

COUPLING EFFECTS; INTERFACIAL COMPOUNDS; MOLTEN SOLDER;

SOLDERED JOINTS;

CHEMISTRY; PACKAGING; PLATINUM; SANDWICH STRUCTURES; SOLDERING; SURFACE PROPERTIES; WELDED JOINTS;

EID: 34247627948     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2007.01.031     Document Type: Article

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