The Interfacial Reaction between Sn-Zn-Ag-Ga-Al Solders and Metallized Cu Substrates

Journal of Electronic Materials

Volumn 33, Issue 1, 2004, Pages 7-13

  Chuang, Chiang Ming ^a   Hung, Hui Tzu ^a   Liu, Pei Chi ^a   Lin, Kwang Lung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Intermetallics; Metallization; Pb free solder; Sn Zn alloy

Indexed keywords

BONDING; COPPER; DIFFUSION; ELECTRONIC EQUIPMENT; ENERGY DISPERSIVE SPECTROSCOPY; INTERMETALLICS; METALLIZING; MICROANALYSIS; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS;

INTERFACIAL REACTION; PB-FREE SOLDER; SN-ZN ALLOYS;

TIN ALLOYS;

EID: 0742303043     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0287-3     Document Type: Article

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