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Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 29, Issue 12, 1998, Pages 2951-2956

A Diffusion-Kinetic Model for Predicting Solder/Conductor Interactions in High Density Interconnections

(3) Ronka K J a Van Loo, F J J b Kivilahti, J K c

a NOKIA SIEMENS NETWORKS (Finland)

b EINDHOVEN UNIVERSITY OF TECHNOLOGY (Netherlands)

c AALTO UNIVERSITY (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COPPER; COPPER COMPOUNDS; DIFFUSION IN SOLIDS; DISSOCIATION; MATHEMATICAL MODELS; PHASE DIAGRAMS; PRECIPITATION (CHEMICAL); REACTION KINETICS; SOLDERED JOINTS; TIN;

HIGH DENSITY INTERCONNECTIONS; MICROJOINING; SOLDER/CONDUCTOR INTERACTIONS;

INTERMETALLICS;

EID: 0032301787 PISSN: 10735623 EISSN: None Source Type: Journal
DOI: 10.1007/s11661-998-0202-2 Document Type: Article

Times cited : (53)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.