Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps

Journal of Electronic Materials

Volumn 33, Issue 10, 2004, Pages 1130-1136

  Wang, S J ^a   Kao, H J ^a   Liu, C Y ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

Mechanical strength; Ni(P); Pb free solder

Indexed keywords

ACTIVATION ENERGY; CORRELATION METHODS; CRYSTAL GROWTH; REACTION KINETICS; REDUCTION; STRENGTH OF MATERIALS; THICKNESS MEASUREMENT; TIN ALLOYS;

INTERFACIAL REACTION; NI(P); PB-FREE SOLDERS; SOLDER BUMPS;

SOLDERING ALLOYS;

EID: 7044251917     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0114-x     Document Type: Conference Paper

References (18)

1. K. Johal and J. Brewer (Paper presented at Proc. IPC Works 2000, Miami, PL, 2000).
2. C.Y. Lee and K.L. Lin, Thin Solid Films 249, 201 (1994).
3. J.W. Jang, D.R. Frear, T.Y. Lee, and K.N. Tu, J. Appl. Phys. 88, 6359 (2000).
4. J.W. Jang, P.G. Kim, K.N. Tu, D.R. Frear, and P. Thompson, J. Appl. Phys. 85, 8456 (1999).
5. Z. Mei, P. Callery, D. Fisher, F. Hua, and J. Glazer, Advances in Electronic Packaging, Proc. Pacific Rim / ASME Int. Intersociety Electronic Photonic Packaging Conf. (New York: ASME, 1997), pp. 543-1550.
6. Z. Mei, M. Kaufmann, A. Eslambolchi, and P. Johnson, Electronic Component and Technology Conf. (Piscataway, NJ: IEEE, 1998), pp. 952-961.
7. M.O. Alam, Y.C. Chan, and K.C. Hung, Microelectron. Reliab. 42, 1065 (2002).
8. D. Goyal, T. Lane, P. Kinzie, and C. Panichas, Proc. 52nd Electronic Component and Technology Conf. (Piscataway, NJ: IEEE, 2002), pp. 732-739.
9. Y.-D. Jeon and K.-W. Paik, 51st Electronic Component and Technology Conf. (Piscataway, NJ: IEEE, 2001), pp. 1326-1332.
10. S.J. Wang and C.Y. Liu, J. Electron. Mater. 32, 1303 (2003).
11. K. Zeng, V. Vuorinen, and J.K. Kivilahti, IEEE Trans. Electron. Packaging Manufacturing 25, 162 (2002).
12. H.D. Blair, T. Pan, and J.M. Nicholson, Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 1998), pp. 259-267
13. H. Matsukia, H. Ibukab, and H. Sakab, Sci. Technol. Adv. Mater. 3, 261 (2002).
14. S.J. Wang and C.Y. Liu, Scripta Mater. 49, 813 (2003).
15. Solder Data Sheet, Welco Castings, Hamilton, ON, Canada.
16. D.R. Frear, S.N. Burchett, H.S. Morgan, and J.H. Lau, eds., The Mechanics of Solder Alloy Interconnects (New York: Van Nostrand Reinhold, 1994), p. 60.
17. D.E. Gray, ed., American Institute of Physics Handbook (New York: McGraw-Hill, 1957), pp. 2 ff-61 ff.
18. S.W. Chen, S.W. Lee, and M.C. Yip, J. Electron. Mater. 32, 1284 (2003).